CHIMEI Foundation · ABS
Polylac PA-747R
Extrusion / Thermoforming Grade
Extrusion grade specifically formulated for thermoforming applications requiring high melt strength and deep draw capability.
Manufacturer
CHIMEI Foundation
Base polymer
ABS
Trade family
Polylac
Status
active
Key specs
Density
1.04 g/cm³
Mold shrinkage
0.4 - 0.7 %
MFI
2.0 g/10 min (200°C/5 kg)
Tensile strength
42 MPa
Flexural modulus
2100 MPa
Izod impact
330 J/m (Notched)
HDT
95 °C (0.45 MPa)
UL94
HB
Color
Opaque pellets
REACHRoHS
Compatible processes
ExtrusionThermoforming
Technical properties
Indicative values. Always consult the manufacturer's official datasheet before specification.
Polylac PA-747R equivalents
No verified equivalents indexed yet.
Typical applications
Luggage and suitcasesAutomotive aftermarket partsProtective coversRefrigerator liners
Base polymer
ABS
See the full ABS technical sheet
Manufacturer
CHIMEI Foundation
Browse all indexed grades